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Ulefone to present first Dimensity 9300+ rugged smartphone at IFA 2024


Ulefone has confirmed that it will officially announce the first rugged smartphone fueled by the MediaTek Dimensity 9300+ SoC. The company will announce this phone at IFA 2024 in Berlin, which kicks off later this week.

Ulefone is planning to announce the very first Dimensity 9300+ rugged smartphone at IFA

It is also worth noting that Ulefone celebrates a 10-year anniversary soon, and an 8-year legacy in making rugged smartphones. With that being said, the upcoming phone will be called the Ulefone Armor 28 Ultra.

Ulefone did reveal some information about the device already. The full announcement will have to wait a bit, but we already have some details. The design of the phone’s back has been revealed by the company, as shown below.

Ulefone to present first Dimensity 9300+ rugged smartphone at IFA 2024

Now, the device that you see above is almost certainly the upcoming phone. It’s an ad supplied by Ulefone, and this phone hasn’t launched yet, so… it definitely fits. This phone seems to have a second display on the back, a tiny round one. No info was shared about it by the company, though.

It will include a 1-inch camera sensor from Sony

This smartphone will also include a 6.67-inch AMOLED display. It will pack in 16GB of RAM and a triple camera setup on the back. Ulefone will even use Sony’s IMX989 1-inch camera sensor here, as the phone’s main camera sensor. You can also expect a thermal variant of the phone to arrive, with thermal imaging capabilities.

Ulefone also highlighted the Armor Mini 20 series. The Armor Mini 20 will become the smallest rugged smartphone in Ulefone’s history. It will feature a 4.7-inch display, a huge 6,200mAh battery, and thermal imaging. That phone is said to arrive in October.

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The company also mentioned the Armor Pad 4 series of tablets. Thermal imaging will be a part of the package here, and this tablet will launch this month. A 10.36-inch 2K display is tipped, and this will be a rugged device too. We’re guessing that both thermal and non-thermal variants are coming.

Ulefone has invited everyone who is in Berlin to visit IFA and Ulefone’s booth H2.6A-104 at Messe Berlin.



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John Smith

My John Smith is a seasoned technology writer with a passion for unraveling the complexities of the digital world. With a background in computer science and a keen interest in emerging trends, John has become a sought-after voice in translating intricate technological concepts into accessible and engaging articles.

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